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NXP Semiconductors
T
( ° C)
T reflow(peak)
250
IP4085/4385/4386/4387/CX4
Integrated high-performance ESD protection diodes
230
217
preheat
cooling rate
t 1
t 2
t (s)
t 3
t 4
t 5
001aai943
The device is capable of withstanding at least three reflows of this profile.
Fig 18. Pb-free solder reflow profile
Table 10.
Reflow soldering process characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
T reflow(peak) peak reflow temperature
230
-
260
? C
t 1
t 2
t 3
t 4
t 5
dT/dt
time 1
time 2
time 3
time 4
time 5
rate of change of
temperature
soak time
time during T ? 250 ? C
time during T ? 230 ? C
time during T > 217 ? C
cooling rate
pre-heat
60
-
10
30
-
-
2.5
-
-
-
-
-
-
-
180
30
50
150
540
? 6
4.0
s
s
s
s
s
? C/s
? C/s
IP4085_4385_4386_4387_CX4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 14 December 2012
? NXP B.V. 2012. All rights reserved.
13 of 18
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